Signal Integrity / Power Integrity Engineer – Advanced Packaging
| Company | Marvell |
|---|---|
| Location | Boise, ID, USA, Burlington, VT, USA |
| Salary | $135000 – $199800 |
| Type | Full-Time |
| Degrees | Bachelor’s, Master’s, PhD |
| Experience Level | Junior, Mid Level |
Requirements
- Bachelor’s degree in electrical engineering or related fields
- 2+ years of related professional experience in package or PCB design, or master’s degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery
- Knowledge of Electrical Engineering concepts, circuit extractions, and simulation
- Design methodology and strategies
Responsibilities
- SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
- Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design
- Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination
- Interfacing with clients to share design feedback and status
- Optimizing design process and fine tuning methodology
Preferred Qualifications
- Experience in package development, including interposer design
- Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
- Familiarity with packaging technologies, materials, package substrate design rules and assembly rules