3D Heterogenous Integration Engineer

Education – Graduating with Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
MS with at least 5-6 years of prior related work experience.
Must have at least an overall 3.0 GPA and proven good academic standing.
Language Fluency – English (Written & Verbal)
Travel – Up to 10%

Lead 3DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materials for the Malta Fab 8 Advanced Semiconductor fab.
Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes.
Develop expertise in the processes, materials and tooling leveraging available characterization resources.
Drive mechanistic understanding of failure modes.
Develop integration schemes to continuously improve yields and to reduce cycle-time & costs. Generate IP related to novel wafer integration & packaging technology.
Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

PhD education level preferred with at least 3-4 years of prior related work experience.
Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills
Strong planning & organizational skills