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Camera Module Design Lead
| Company | Apple |
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| Location | Cupertino, CA, USA |
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| Salary | $143100 – $264200 |
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| Type | Full-Time |
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| Degrees | Bachelor’s |
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| Experience Level | Mid Level, Senior |
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Requirements
- Bachelors in a relevant field (Mechanical Engineering, Electrical Engineering, Optics, Mechatronics Engineering or equivalent) and a minimum of 3 years relevant industry experience.
Responsibilities
- Definition and trade-off studies of RGB camera optics, sensors, actuator, and packaging.
- Interaction with optical, electrical, process, controls systems, sensing, test, and mechanical teams on integration of camera hardware into products.
- Leadership of offshore manufacturing partners on camera design evaluation, product prototype builds, and qualification.
- Leadership of failure analysis and corrective action implementation at manufacturing sites as well as remotely, including assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures.
- Evaluation and debugging of camera HW at module and product levels for Camera/Depth Design and Integration.
- Documentation of camera-specific design, test, and manufacturing requirements.
- International travel may be required to supplier facilities for product development and production bring-up.
Preferred Qualifications
- Understanding of camera system architecture, including optical components, system integration, image/depth sensor and image signal processing
- Understanding of geometric optics and image quality evaluation including test charts, algorithms, and lighting conditions
- Proficiency in electronic circuit and system design including power delivery, signal integrity
- Design and analysis of highly constrained, high-volume actuators or translational mechanisms. Experience with mechanical modeling, finite element analysis (FEA) and tolerance stack-up analysis
- Understanding of compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc.
- Knowledge of failure analysis techniques including optical microscopy, X-ray, CT scans, SEM, etc. Ability in root-cause and corrective-action analysis
- Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.
