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Camera Module Design Lead
| Company | Apple |
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| Location | Cupertino, CA, USA |
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| Salary | $143100 – $264200 |
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| Type | Full-Time |
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| Degrees | Bachelor’s |
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| Experience Level | Mid Level, Senior |
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Requirements
- Bachelors in a relevant field (Mechanical Engineering, Electrical Engineering, Optics, Mechatronics Engineering or equivalent) and a minimum of 3 years relevant industry experience
Responsibilities
- Design of Multi-Camera architectures targeting the highest level of user experience while meeting system integration and industrial design requirements.
- Definition of the overall product development cycle and milestones for multiple camera. Work includes DFMEA, de-risk planning, KPIs at each milestone etc.
- Maintain, drive and present executive updates on camera integration status, major issues list and recommendations to leadership
- Leadership of offshore Multi-Camera and Form Factor manufacturing partners through mentoring, evaluation, prototype build cycles. International travel may be required to supplier facilities.
- Data analysis and optimizations of assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures.
- Failure analysis and debugging of camera HW and SW at product levels for Camera/Depth Design and Integration in order to determine corrective actions across the supply chain.
- Documentation of Multi-Camera design, test, and manufacturing requirements
Preferred Qualifications
- Ability to learn quickly and become familiar with several different technology areas. At least 2+ years relevant experience in camera/depth technology or related electronics industry.
- Ability to lead a multi-functional team of engineers and scientists with unique background and technical expertise through the R&D phase of product development from concept to mass production.
- Ability to influence other teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development environment while keeping leadership updated on status and next steps
- Proven track record of successfully delivering new compact products preferably camera into mass production on time, meeting yield and efficiency targets.
- Failure analysis techniques such as optical microscopy, X-ray, CT scans or SEM. Ability in root-cause and corrective-action analysis.
- Proficiency in statistical analysis, data reporting, and visualization.
- Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms.
- Electronic circuit and system design including power and signal integrity and coexistence of modules
- Understanding of geometric optics and image quality evaluation including test charts, algorithms, and lighting.
