Engineer – Semi Packaging Engineering
| Company | Analog Devices |
|---|---|
| Location | Burlington, MA, USA |
| Salary | $Not Provided – $Not Provided |
| Type | Full-Time |
| Degrees | Master’s |
| Experience Level | Entry Level/New Grad, Junior |
Requirements
- Minimum of Master’s degree in Engineering (mechanical engineering or electrical engineering)
- Required to have educational background in fundamentals of materials and their mechanical behavior
- Must have hands-on experience with ability to perform deep dive in 3D CAD tools (e.g. SolidWorks) and FEA software ANSYS
- During interview process, must be able to demonstrate exceptional communication skills, learning mindset, and problem-solving skillset
- Candidates having work experience up to 1-year after master’s graduation are encouraged to apply
Responsibilities
- Work with cross-functional team to develop advanced IC packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups
- Perform component or system level mechanical stress and thermal simulations
- Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification
- Document manufacturing process flows and control plans for IC packages at company’s external suppliers
- Work with quality and reliability groups to establish the reliability criteria and qualification plan for various end applications
- Communicate complex engineering ideas to global teams in simple and effective way but rooted in engineering principles
Preferred Qualifications
- Prior internship experience in semiconductor IC or electronics assembly would be distinct advantage