Manufacturing Technician – Wire Bonding
| Company | Microchip Technology |
|---|---|
| Location | Lowell, MA, USA |
| Salary | $Not Provided – $Not Provided |
| Type | Full-Time |
| Degrees | |
| Experience Level | Senior |
Requirements
- Ability to multi-task while paying careful attention to detail
- Prior success working both individually and in a team environment
- Good written and verbal communication skills
- Ability to follow written and verbal direction
- Ability to read, comprehend and follow detailed work specifications
- Excellent listening skills
- Adaptability to frequent change and improvements
- Regular and predictable attendance is essential
- Ability to wear the required Protective Equipment
- Basic computer, math and reading comprehension skills
- You must be 18 years old with a high school diploma or GED
- High school degree or equivalent
- 5-7 years of related experience
- Good dexterity, eye/hand coordination
- Ability to read and work from detailed process sheets and drawings
- Must be able to follow written and verbal instructions
- Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities
Responsibilities
- Perform component wire bonding functions in the production of RF transistor packaged devices
- Operates automatic and semi-automatic wire bonders and bond pull tester in performing wire bonding functions
- Work on assignments specified by build sheets, requiring attention to detail, high quality and consistent work rate
- Operates various wire bonding equipment with ability to multi-task by working on several pieces of equipment
- Able to independently set-up and make minor adjustments on wire bond machine
- Able to work with test technicians and determine optimum wire bonding parameters, including but not limited to adjusting loop heights
- Discuss technical problems encountered with supervisor or technical personnel.
Preferred Qualifications
-
No preferred qualifications provided.