NAND Package Quality and Reliability Engineer
| Company | Solidigm |
|---|---|
| Location | Rancho Cordova, CA, USA |
| Salary | $Not Provided – $Not Provided |
| Type | Full-Time |
| Degrees | Bachelor’s |
| Experience Level | Mid Level, Senior |
Requirements
- Bachelor’s degree in Mechanical Engineering, Material Science or related field
- 4+ years of experience in semiconductor package development and reliability
- Able to engage in root cause analysis, design of experiments, and data analysis
- Excellent communication skills to work effectively across different geographies
Responsibilities
- Influence new package/board design, process and material capability decisions based on fundamental technical understanding of package reliability failure mechanisms and package-board interactions
- Perform package and board design/assembly risk assessments and develop a qualification plan supporting product launch
- Collection and analysis of all stress test data (HAST, TC, Precon, HTS, SJR)
- Design test vehicles to isolate failure mechanisms and the root causes, e.g., daisy chain test vehicle (DC TV)
- Innovate analytical and experimental methods to validate package technology reliability, especially with respect to SJR
- Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners
Preferred Qualifications
- Hands-on experience of fault isolation and failure analysis, including electrical testing, layout analysis, daisy chain TV design
- Knowledge of Printed Circuit Board (PCB) assembly processes and package to board interconnects
- Knowledge of package and board design software (Cadence Allegro/Mentor)