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Packaging and Integration Intern
| Company | HRL Laboratories |
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| Location | Malibu, CA, USA |
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| Salary | $30 – $35 |
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| Type | Internship |
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| Degrees | Bachelor’s, Master’s |
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| Experience Level | Internship |
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Requirements
- Ability to perform and organize data analysis
- Understanding of basic package device assembly processes and techniques
- Background in semiconductor processing techniques (lithography, dry etch, vacuum deposition, etc.) and how they relate to device design and layout.
- Student currently pursuing a degree in Materials Science, Physics, Chemistry, Engineering, or a related field.
Responsibilities
- Support and assist a diverse team of scientists and engineers in the development of novel 2.5D and 3D package devices.
- Support in the development of novel 2.5D and 3D semiconductor integration processes for dense high speed mixed signal electronics applications.
- Perform theory-driven analyses of candidate approaches.
- Assist with research and development projects.
- Present results in written reports and oral presentations.
- Assist in physical and electrical package evaluation.
- Assist in the development and microfabrication of passive devices.
Preferred Qualifications
No preferred qualifications provided.
