Principal Mechanical Engineer - Microelectronics Packaging

Principal Mechanical Engineer – Microelectronics Packaging

Bachelor’s degree (typically in Science, Technology, Engineering or Mathematics (STEM)) and a minimum of 8 years of prior relevant experience OR Advanced Degree in a related field and minimum 5 years experience OR In absence of a degree, 12 years of relevant experience is required
Must be a U.S. Citizen
Must have or be capable of obtaining a US Department of Defense (DoD) security clearance. Candidate selected will be subject to a government security investigation/reinstatement and must meet eligibility requirements
Knowledge of mechanical principles and techniques commonly used in product development
Applied knowledge of moderate to advanced mechanical engineering principles and techniques
Capable of performing mechanical design and analysis to meet severe environment system requirements
Proficiency in 2D and 3D computer aided design (CAD) tools (e.g. AutoCAD, Solidworks)
Working knowledge of structural, dynamic and thermal analysis tools (e.g. ANSYS)

Microelectronics design and manufacturing assembly
Flip chip experience including development and design is preferred
Microelectronic packaging materials and material properties
Post wafer fabrication processes
Failure analysis techniques
Demonstrated capability in design for low cost, manufacturability and small volume packaging
Ability to decompose mechanical requirements to support design efforts
Proficiency in MS Office products
Experience with cost account and schedule management
Experience with geometric dimensioning and tolerancing (GD&T)
Excellent interpersonal and communication skills, written and verbal, to support frequent customer meetings and pursuit related activities
Ability to work in a team environment and interact with various engineering disciplines (e.g. mechanical engineers, electrical engineers and system engineers)