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Principal / Senior Principal Plasma Enhanced Chemical Vapor Deposition – Pecvd – Semiconductor Process Engineer
| Company | Northrop Grumman |
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| Location | Halethorpe, MD, USA |
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| Salary | $102400 – $190600 |
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| Type | Full-Time |
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| Degrees | Bachelor’s |
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| Experience Level | Senior, Expert or higher |
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Requirements
- Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 5 years of relevant experience (3 years with a MS, 0 with a PhD) for Principal position
- Bachelors of Science in Electrical Engineering, Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 8 years of relevant experience (6 years with a MS and 3 with a PhD) for Senior Principal position
- Must have PECVD industry experience
- Hands-on experience running semiconductor process equipment and with process sustaining/development activities
- Must be able to work independently, providing technical solutions to a wide range of complex problems
- Must be able to work a large percentage of time working in a Class 100 cleanroom environment
- Must be able to work the weekday shift, covering at a minimum Monday – Friday
- Knowledge of statistical process control (SPC)
- Must be a US Citizen
- Must be able to obtain and maintain a Secret clearance
Responsibilities
- All aspects of sustaining existing PECVD processes for a development line including process qualifications and technician training
- Interfacing with other unit process engineers, operations, and integration engineers during the design and execution of process/equipment improvement projects
- Developing PECVD processes for new materials
- Developing new PECVD processes for emerging technologies in both microelectronics and superconducting electronics
- Writing and maintaining process documentation
- Supporting statistical process control (SPC) and continuous improvement efforts
- Performing all other related duties as assigned
Preferred Qualifications
- Direct experience with semiconductor fabrication, working in a cleanroom environment
- Hands-on experience running PECVD/Diffusion/Implant/RTP process equipment and with process sustaining/development activities
- Experience with TEOS- and silane-based dielectric deposition
- Experience with thin film characterization equipment and techniques
- Experience with PECVD, ALD, MOCVD, Diffusion, RTA/RTP, Implant
- Demonstrated ability to communicate well with others and work independently
- Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions
- Experience in structured problem-solving methodology to troubleshoot tool and process issues
- Data analysis and visualization (JMP and/or MiniTab)
- Advanced knowledge of statistical process control (SPC)
- Active Secret clearance
