Process Engineer / Principal Process Engineer
| Company | Northrop Grumman |
|---|---|
| Location | Halethorpe, MD, USA |
| Salary | $83300 – $124900 |
| Type | Full-Time |
| Degrees | Bachelor’s, Master’s, PhD |
| Experience Level | Junior, Mid Level, Senior |
Requirements
- Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 2 years technical related experience in semiconductor fabrication; Masters with 0 years exp
- Have basic understanding/knowledge of semiconductor Plasma Etch, PVD, CVD, WETs, CMP, Photolithography or other related semiconductor processing
- Able to work independently with hands-on experience in operating tools, gathering, and analyzing data
- Candidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including engineers, technicians, and management
- US citizenship required
- Must be able to obtain and maintain a Secret Clearance
- Must be able to work 2nd shift (Mon-Fri, 2:00PM-11:00PM), or 3rd shift (Mon-Fri, 10:00PM-7:00AM), or 4th shift (Fri-Sun, 7:00AM-7:00PM), or 5th shift (Fri-Sun, 7:00PM-7:00AM)
- Bachelor’s Degree or higher in Materials Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or closely related discipline with 5 years technical related experience in semiconductor fabrication; Master’s Degree with 3 years’ experience; PhD with 0 years experience
- Have understanding/knowledge of semiconductor Plasma Etch, PVD, CVD, WETs, CMP, Photolithography or other related semiconductor processing
- Able to work independently with hands-on experience in operating tools, gathering, and analyzing data
- Candidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including engineers, technicians, and management
- US citizenship required
- Must be able to obtain and maintain a Secret Clearance
- Must be able to work 2nd shift (Mon-Fri, 2:00PM-11:00PM), or 3rd shift (Mon-Fri, 10:00PM-7:00AM), or 4th shift (Fri-Sun, 7:00AM-7:00PM), or 5th shift (Fri-Sun, 7:00PM-7:00AM)
Responsibilities
- All aspects of sustaining Plasma Etch, PVD, CVD, WETs, CMP, or Photolithography processes for semiconductor manufacturing. This includes process qualifications, technician training and certification, and process safety
- Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies
- Supporting statistical process control (SPC) and continuous improvement efforts
- Establishing standard operating procedures and engaging the operations team to ensure these are followed
- Performs all other related duties as assigned
Preferred Qualifications
- Hands-on experience in Plasma Etch, PVD, CVD, WETs, CMP, or Photolithography techniques and practices
- Experience in superconductor microelectronics will be highly desired
- Experience in lean manufacturing practices and structured problem-solving methodology
- User of various software packages commonly found in Semiconductor Wafer Fabs – EMS Systems (FactoryWorks or alike systems), statistical analysis tools – SPACE, JMP, Minitab, etc.
- Active Secret Clearance