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Senior Program Manager – Chip Assembly Manufacturing Operations
| Company | NVIDIA |
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| Location | Santa Clara, CA, USA |
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| Salary | $184000 – $287500 |
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| Type | Full-Time |
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| Degrees | Master’s |
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| Experience Level | Senior, Expert or higher |
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Requirements
- Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience); Business management degree preferred
- 12+ year validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging- photonics packaging experience is a plus
- Solid technical knowledge of materials, process, package design and equipment technologies in substrate, bumping, and chip assembly
- Strong skills in project management and supplier management
- Good understanding of quality control, statistics process control, gage R&R and DOE techniques
- Good knowledge of packaging industry and its supply chain
- Excellent communication skills
- Working with multi-functional teams across the world
Responsibilities
- Manage BOM supply chain and optimize sourcing solutions for best capacity and cost
- Bring new products and new technologies to high volume manufacturing
- Deliver datamation solutions for enhanced decision making
- Manage supplier performance evaluation matrix and keep it updated based on changing business needs
- Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability
- Lead change control through qualification and notification
- Lead non-conforming material disposition and problem solving
Preferred Qualifications
- Business management degree preferred
