Senior Signal and Power Integrity Engineer – Hardware
Company | NVIDIA |
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Location | Austin, TX, USA, Santa Clara, CA, USA |
Salary | $168000 – $310500 |
Type | Full-Time |
Degrees | Bachelor’s, Master’s |
Experience Level | Senior |
Requirements
- BS/MS-Electrical Engineering or equivalent experience
- 6+ years of industry experience
- Strong technical background in applied electromagnetics, transmission line theory and signal processing
- SI work on one or more signaling standards like PCI express, USB, SATA, HDMI, HBM, DDR5, GDDR6, LPDDR5X, etc.
- Hands on use of 3-D modeling tools like ANSYS HFSS/Q3D, 2.5-D with ANSYS SIWAVE or similar and 2D such as Ansys2D
- Familiarity with a system level timing or loss budget including silicon, package and board impairments
- Familiarity with use of VNA, TDR, DSO, ParBERT and use of tools/applications like ADS, Ansys Designer, JMP, Matlab, Cadence Allegro
Responsibilities
- Work on crafting creative Signal Integrity solutions to complex system design problems
- Modeling and Optimization of vias, connectors, sockets, breakouts and various system components in 3D EM tools
- System-level signal integrity simulations of high-speed NVlink 200Gbs+, USB-4, PCIe5, GDDR6, LP5X and other interfaces
- Constant improvements of SI models using data from lab measurements and/or modelling tool/methodology updates
- Substrate and board layout SI guidelines creation, review and post layout SI extractions
- Simulation automation, data gathering, analysis and visualization using JMP, MATLAB or similar tools
- Opportunity to work in a dynamic cross-functional role to optimize package, PCB, ASIC, mixed signal circuit
Preferred Qualifications
- Expertise in one or more of the high speed interface SI/PI design on any industry standard system platforms
- Experience with lab measurements, debugging, SI lab correlation using oscilloscope/ spectrum analyzer/ VNA
- Knowledge of circuit design, board/pkg technology & design, link architecture, timing budget methodologies
- Familiarity with PDN evaluation using layout extraction tools for packages and PCBs and spice-based time domain simulations