Sentinel – Gbsd – Material Process Engineering Manager 2

Sentinel – Gbsd – Material Process Engineering Manager 2

Requirements

• Bachelor’s Degree in a STEM degree from an accredited university and 6 years experience in DoD, aerospace, oil and gas, or nuclear regulated industries; Master’s Degree in a STEM degree from an accredited university and 4 years experience in DoD, aerospace, oil and gas, or nuclear regulated industries
• Minimum 1 year experience leading a project and/or driving performance against schedule, in a PM&P organization
• 2 years of experience in components engineering and PM&P engineering disciplines.
• Experience in ensuring that PM&P program or contract requirements are applied to parts, materials and assemblies
• Experience performing Electrical and electronic parts selection to meet program objectives and requirements
• Experience in military/space electronics design or manufacturing
• Must have an active U.S. Government DoD Secret security clearance at time of application, current and within scope, with an ability to obtain and maintain Special Access Program (SAP) approval within a reasonable period of time, as determined by the company to meet its business need.

Responsibilities

• Manage a team of PM&P engineers within a matrixed functional organization, ensuring integration and collaboration across design and manufacturing teams under an overarching Systems Engineering framework.
• Provide performance feedback, training, mentoring and coaching to your employees.
• Support workforce planning and maintain sufficient depth and breadth of skillsets within your teams core discipline to meet program needs.
• Responsible for employee performance reviews and supporting employee career development.
• Support development and refinement of processes and tools that support business areas and programs in achieving their missions.
• Support proposal work, independent technical reviews, program standup and audits, and special assignments on an as needed basis.
• Support employee engagement, hiring, development, training, attraction, and retention of top talent.
• Provide technical support to Sentinel program ensuring integration and effective collaboration with design teams to achieve program objectives.
• Lead EEEE PM&P engineers in selection and application of Electrical, Electronics, Electro-Mechanical, Electro-Optical (EEEE) parts, including Microcircuits, Connectors, Passive Devices, and Printed Circuit Boards.
• Oversee development of Component Specifications or Source Control Documents to meet Program Requirements.
• Oversee development and execution of qualifications of new EEEE components for use in new Circuit Card Assembly designs.
• Work with manufacturing and Component vendors to resolve qualification, producibility, and test issues with parts and Circuit Card Assemblies.
• Interface with program office on CDRLs, requirement tailoring, and other PM&P issues.
• Oversee and adjudicate resolution of issues with interfacing disciplines/functions.
• Tailoring and allocating EEEE Part and Circuit Card Assembly requirements to System, Subsystem, and Unit Level Specifications.
• Oversee EEEE PM&P engineers in supporting Program Subcontractors with EEEE Part requirements interpretation and review of Subcontractor Data Requirements Lists (SDRLs).
• Provide mentoring and coaching on technical issues within your area of expertise.
• Perform risk analysis, trade studies, process improvement analysis, cost estimates, as applicable.
• Tracking to completion tasking and assignments for the team, assisting with workload balancing across team members, collecting metrics, and performing other project management functions for the team as applicable.
• Ensure team members have the required tools and access to perform PM&P responsibilities.
• Collaborate with other engineering assignment managers/leads to align priorities and support overall execution of program objectives.

Preferred Qualifications

• Bachelor’s Degree in Materials Science, Industrial Engineering, Electrical Engineering or Chemical Engineering
• Special Program Access
• Experience interpreting and ensuring design compliance to industry and/or military standards and specifications for parts and materials
• Experience performing requirements tailoring, requirement allocation, requirement traceability, or requirement verification
• Experience using Seimens Xpedition or Seimens Capital software
• Working knowledge of MIL-STD-1580 Destructive Physical Analysis for electronic, electromagnetic and electromechanical components
• Working knowledge of various NASA & Military Performance documents required for the selection and screening of Space, Military, DSSC, Non-Standard, and Commercial-Off-The-Shelf components, including MIL-PRF-38534 (Hybrids), MIL-PRF-38535 (microcircuits), MIL-PRF-19500 (semiconductors), MIL-PRF-123 (capacitors), MIL-PRF-55342 (resistors), MIL-PRF-39016 (relays), MIL-PRF-981(magnetics), IPC-6012 and MIL-PRF-31032 (Printed Circuit Boards) and various electrical interconnect systems.
• Experience developing Source Control Drawings or Component Specifications for EEEE components
• Experience developing and conducting qualification of EEEE components
• Working knowledge of Failure Analysis, physics of failure, Root Cause & Corrective Action for EEEE components
• Experience performing EEEE component screening & qualification, component application qualification, and related installation/assembly process specifications
• Experience with derating analysis of EEEE components
• Experience in parts, materials and process manufacturing support for EEEE components
• ICBM experience
• 2 years experience in a people leadership role, or 4 years experience as a technical lead, in a PM&P organization
• Working knowledge of SharePoint, JIRA, Confluence, Microsoft teams, siemens teamcenter or other life cycle management systems
• Experience in project management including microsoft project and visio
• Experience writing and defending technical position papers
• Experience working with chief engineers and Integrated Product Teams
• Experience working in Agile and digital design environments
• Demonstrated ability to delegate tasks, and mentor junior engineers
• Experience reviewing technical drawings and engineering data for parts and assemblies
• Experience working with subcontractors
• Understanding of supply chain management as it relates to parts management and obtaining technical specifications on components
• Excellent communication, interpersonal skills, and the ability to interface with all levels of employees and management
• Ability to function in a dynamic and collaborative environment, and be flexible to changing direction
• Familiar with the application of EEEE components in systems design
• Familiar with various NASA & Military Performance documents required for the selection and screening of Space, Military, DSSC, Non-Standard, and Commercial-Off-The-Shelf components, including MIL-PRF-38534 (Hybrids), MIL-PRF-38535 (microcircuits), MIL-PRF-19500 (semiconductors), MIL-PRF-123 (capacitors), MIL-PRF-55342 (resistors), MIL-PRF-39016 (relays), MIL-PRF-981(magnetics), IPC-6012 and MIL-PRF-31032 (Printed Circuit Boards) and various electrical interconnect systems.
• Familiar with Circuit Card Assembly (CCA) design, development, or manufacturing
• Familiar with cable and wire harness design, development, or manufacturing
• Experience with derating, and/or upscreening
• Must be proficient in Microsoft Office tools