VP – Packaging Technology – ASICS Engineering
| Company | Qualcomm |
|---|---|
| Location | San Diego, CA, USA |
| Salary | $Not Provided – $Not Provided |
| Type | Full-Time |
| Degrees | Bachelor’s, Master’s |
| Experience Level | Expert or higher |
Requirements
- 15+ years of experience in the packaging industry
- Bachelor’s degree in a related field of study
- Advanced expertise in multiple package technology including Redistribution Layer (RDL) and advanced substrate technology
- Master’s degree or higher
Responsibilities
- Lead the development and implementation of cutting-edge packaging solutions, work with Business and technical leaders.
- Provide expert guidance and mentorship to junior engineers and team members.
- Actively collaborate with cross-functional teams to ensure the successful integration of packaging solutions in product designs.
- Foster a team-oriented environment, promoting knowledge-sharing and effective communication.
- Drive continuous improvement initiatives to enhance packaging efficiency, reliability, and performance.
- Stay abreast of industry trends and emerging technologies to ensure the company remains at the forefront of packaging advancements.
- Oversee multiple packaging projects from conception through completion, ensuring timely delivery within budget constraints.
- Coordinate with internal stakeholders and external vendors to achieve project objectives.
Preferred Qualifications
- 20+ years of experience in the packaging industry
- Bachelor’s degree in a related field of study