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Yield Analysis – Ya – Engineer – Foundry
Company | Intel |
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Location | Phoenix, AZ, USA |
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Salary | $130300 – $183950 |
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Type | Full-Time |
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Degrees | Bachelor’s |
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Experience Level | Mid Level |
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Requirements
- Bachelor’s degree in one of the following disciplines: Electrical/Electronic Engineering, Physics, Chemistry, Materials Science, or in a (STEM) related major.
- 3+ years of experience in any of the following areas: Python and other program languages to develop a new analysis method and algorithms using large amount of fab data.
- Big data analysis and machine learning.
- Advanced Node semiconductor high-volume manufacturing.
- Device Physics and overall FinFET process flow.
Responsibilities
- Own engineering projects involving large-scale data analysis and machine learning to support HVM yield roadmap, device targeting and attaining performance targets.
- Work with Program Managers, Process Integration, Device and Defect Reduction team members to identify root cause of systematic yield/performance issues and propose mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
- Work with Yield Modeling team to develop new yield analysis methods and algorithms to deliver world class yield analytics.
- Formulate yield problems mathematically, identify solutions, and remove technical barriers to achieve successful solutions.
- Provide yield analysis for various engineering projects to improve quality, performance and to reduce wafer cost.
- Engineering support for technical interactions with internal and external customers.
Preferred Qualifications
- Advanced degree (Master’s or Ph.D.) in one of the following disciplines: Electrical/Electronic Engineering, Physics, Chemistry, Materials Science, or in a (STEM) related major.
- 2+ year of experience in advanced node semiconductor industry in yield analysis and data science.
- Work experience in TFT environment.
- Experience in new semiconductor technology development.
- Experience in module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and process integration.